For the first time in Japan, Associate Professor Fumihiro Inoue of Yokohama National University Graduate School of Engineering was selected by the IEEE Electronics Packaging Society for the IEEE International Award "Outstanding Young Engineer Award".This gift is given to researchers under the age of 35 who have made remarkable contributions in the field of semiconductor packaging, and has the potential to facilitate the development of electronic devices that require large R & D expenses and infrastructure investment. The study was highly appreciated.
According to Yokohama National University, IEEE is the world's largest academic society for electrical and information engineering, headquartered in the United States.This year, only Associate Professor Inoue was selected for the International Award.The award ceremony was held in the United States, and Associate Professor Inoue could not attend due to the Korona-ka, but about 1,500 attendees praised Associate Professor Inoue for his achievements.
Electronic devices are the core technology that is indispensable for realizing a sustainable society, but for cutting-edge manufacturing technology, major companies have set up manufacturing bases equipped with ultra-high-priced equipment such as ultra-ultraviolet lithography exposure machines, and have invested a large amount of R & D expenses. The current situation is that we have to.
Three-dimensional integration is a technology that enables devices to be stacked three-dimensionally to achieve high integration, high speed, and low power consumption, and was evaluated as having the potential to overcome the problems faced by manufacturing sites.
reference:[Yokohama National University] IEEE International Award, first Japanese award
