A research group led by Assistant Professor Yuji Okubo of Osaka University has realized strong adhesion between the fluororesin PTFE (Teflon) and the silicone resin (PDMS).Furthermore, by applying this technology, we have developed the world's first technology to strongly bond "fluororesin and metal" and "fluororesin and glass" without adhesive.
Until now, chemicals have been used to improve the adhesiveness of fluororesin, and adhesives have also been used to bond fluororesin to metal and fluororesin to glass.However, chemicals containing metallic sodium are harmful to workers and the environment, and there is also the problem of volatile organic compounds (VOC) due to the use of adhesives, and there are concerns about their use in the medical and food fields where safety is important. Was there.
The research group has been engaged in research to improve the adhesion between dissimilar materials by irradiating the surface of polymer materials with atmospheric pressure plasma to activate the surface.Until now, strong adhesion was achieved by performing plasma treatment only on the fluororesin side between the fluororesin and the unvulcanized rubber, but this time, the silicone resin, which is vulcanized rubber, is also plasma-treated. Therefore, strong adhesion between fluororesin and silicone resin was realized.
Furthermore, by combining the conventional technique of strongly adhering the plasma-treated silicone resin to metal or glass and the (heat-assisted) plasma treatment while heating, "fluororesin and metal" are passed through the silicone resin with plasma treatment on both sides. , "Fluororesin and glass" have been strongly bonded.
Since the technology developed this time is adhesive-free, it is expected to be applied in the fields of VOC reduction (low environmental load, prevention of sick house syndrome) and medical / food fields.In addition, since it can be applied to inorganic materials other than copper, stainless steel, and glass, it may contribute to the multi-materialization of various materials.
